CN
ijiwei Talk EP170: GaN’s challenges on the way to 200mm production
Chinese article by 邓颖珊
English Editor 刘燚
06-21 18:08

Moving towards 200mm wafer production seems to be an inevitable path for GaN semiconductor device as both of its strong competitors, Si and SiC, have made the transition. From technology development to manufacturing standardization, let’s learn more about the challenges that GaN needs to overcome with Dr. Victor Veliadis from PowerAmerica.

Dr. Veliadis is Executive Director and CTO of PowerAmerica, a WBG semiconductor power electronics Manufacturing Institute. He is also an ECE Professor at NCSU, an IEEE Fellow and EDS Distinguished Lecturer.

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