By Gabby Chen

(JW Insights) Mar 7 -- Boncom Semi (博康半导体), a Chinese chip startup, started construction of its gallium nitride (GaN) RF power chip project in Jiaxing Economic Development Zone, the national-level development zone announced on March 6.

With a total investment of nearly RMB 600 million ($86.63 million), the new project covers an area of 46,667 square meters. It will include R&D, manufacturing and sales, targeting third-generation semiconductor chip and material markets.

Founded in 2022, the Jiaxing-based Boncom Semi mainly provides devices for the RF sector such as 5G mobile communication base stations and broadband communications.