Chinese automotive tier-1 supplier Hangsheng Electronics signs MOU with Qualcomm China to cooperate in intelligent connected vehicle technology innovation
Chinese article by 爱集微
English Editor 张未名
04-24 17:47

By Gabby Chen

(JW Insights) Apr 23 -- Hangsheng Electronics(HSAE航盛电子), a Chinese automotive tier-1 supplier, signed a memorandum of understanding (MOU) with Qualcomm Wireless Communication Technologies (China) - a US chip giant's subsidiary to cooperate in intelligent connected vehicle (ICV) technology innovation, announced Hangsheng Electronics on April 21.

Hangsheng Electronics plans to develop new applications and solutions based on Qualcomm's Snapdragon® digital chassis solution and other automotive products.

The partnership will cover the development of Hangsheng's next-generation intelligent cockpit platform, which is expected to leverage AI engines and innovative resources of the latest Snapdragon cockpit platform.

Hangsheng Electronics was founded in 1993 in Shenzhen of southern China's Guangdong Province. Its main business covers intelligent cockpit and driving, network connection, new energy vehicle electronic control, as well as software engineering.

Yin Yutao, VP and CTO of Hangsheng Electronics, stated, " The partnership is expected to promote the development of the automotive electronics industry and contribute to China's solution for global intelligent automotive development."

Sheng Kuang, senior VP of sales at Qualcomm China, noted that the company's Snapdragon digital platform for cars is gaining recognition from automakers and major suppliers.

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