There are about 19 related results
* Contains illegal characters, please re-enter.
SMIC admits a tight capacity this year and will continue boosting investment
Leading Chinese silicon wafer suppliers are actively expanding their 8/12 inch silicon wafer
Changes in climate anomalies are becoming more and more frequent
China’s leading packaging company TF Microelectronics has a joint venture in Malaysia with the U.S. chip giant AMD called TF Microelectronics Sdn Bhd, which plans to expand its manufacturing facility with nearly $454.7 million.
“Why Advanced Packaging Materials Matter?” gives insights in two parts on this new frontier of semiconductor technology developments.
China’s fab equipment spending for front-end facilities is expected to reach $17 billion in 2022
ASML, the world's leading lithography machines provider, continues to expand its Chinese team and plans to recruit more than 200 new employees this year to support its growth in the Chinese market.
Major Chinese IC packaging companies have stepped into advanced packaging—FCBGA in particular, but need to survive the current market downturn, said a JW Insights article.
YMTC and CXMT expanding capacity brings growth opportunities for Chinese OSAT vendors