By Li Panpan
China's leading display maker BOE announced to invest RMB29 billion ($3.99 billion) to build a 6-generation new semiconductor display chip production line through its subsidiary in Beijing on October 30.
The announcement said the production line using LTPO technology would produce high-end VR display products like VR display panels and MiniLED direct display backplanes, further enriching its product structure.
The designed production capacity is about 50,000 pieces per month. The construction period is scheduled to start in 2023, with mass production in 2025 and full-scale production in 2026, said BOE.
The project will strengthen its competitiveness, meet the needs of the VR market and increase its high-end display device production, added the firm.
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