By Kate Yuan
TF Microelectronics (通富微电), China’s leading packaging company, announced on October 24 that it has completed the R&D of 5nm chips packaging for autonomous vehicles, and will enter the mass production stage gradually by partnering with international giants, JW Insights reported.
The company will mass-produce the 5nm chips on a small scale in the second half of the year, CINNO Research said in a report in mid-October.
TF Microelectronics has been in automotive electronics for 20 years, and has passed the certification of the global automotive industry quality management system IATF16949, the company said in a online interaction with investors on October 24.
Founded in 1997, TF Microelectronics is headquartered in Nantong of eastern China’s Jiangsu Province. It went listed on the Shenzhen Stock Exchange in 2007.
It has joined hands with international automotive chip giants including Infineon, NXP, STMicroelectronics, and Bosch. Domestic partners include BYD, Silan Microelectronics, and automotive electronics designer AutoChips, covering processors, power management, and battery management, the company added.
The world's top 10 packaging and testing companies take up about 80% of the global revenue, and TF Microelectronics is among the three companies from China’s mainland on the list, according to a recent report by the Market Intelligence & Consulting Institute (MIC).
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