By Li Panpan
(JW Insights) Mar 30 -- US chip giant Qualcomm signed to build an automotive chip R&D center in Chengdu, southwestern China’s Sichuan Province, said the local government at a joint project signing ceremony on March 29.
It will be Qualcomm's first R&D center in Sichuan. It will cooperate with the upstream and downstream of Qualcomm's automotive industry chain companies to develop autonomous driving and intelligent cockpit products.
The center will further improve Chengdu's ecosystems in the electronic information industry and intelligently networked automobile industry, said the local government.
The joint project signing ceremony in Chengdu covered 33 projects involving a total of RMB104.23 billion ($15.13 billion) investment, said the local government.
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