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Wafer process equipment maker ACM Shanghai wins order from top U.S. semiconductor manufacturer
Chinese article by 爱集微
English Editor 张未名
12-09 16:28

Editing by Xin Lanhua

Wafer process equipment and solution provider ACM Shanghai announced in early December that it had won two orders for cleaning equipment from a major U.S. semiconductor manufacturer.

The orders for ACM Shanghai(盛美上海) are scheduled to be delivered in the first and second quarter of 2022, respectively.

The first order is for evaluation equipment to verify the cleaning performance and determine the specific configuration of the equipment. The second one is equipment for mass production line, according to ACM.

David Wang, ACM's founder, and CEO said, "These orders are of great significance, indicating that ACM has expanded our customer base to the major international manufacturer. This also means success in our market strategy. We have promoted our original differentiated technology to key clients in Asia first, then to the world's leading manufacturers."

He added, "The reason why this manufacturer chose ACM's solution is partly based on the fact that our cleaning equipment can fulfill its requirement on advanced process and function. We believe the success of these two pieces of equipment will bring greater business opportunities for cooperation with major customers. This is another milestone for ACM's globalization strategy after it won SK Hynix and other international customers."

ACM Shanghai is the subsidiary of ACM Research, Inc., which was founded by a group of Tsinghua University alumni in 1998 in Silicon Valley. It develops wet processing technology and products for the semiconductor and wafer-level packaging (WLP) industries, focusing on cleaning technologies.

ACM Shanghai was listed in STAR Market under Shanghai Stock Exchange (stock code 688082) in November 2021. It operates in Zhangjiang High-Tech Park in Shanghai.  

ACM has established important intellectual property (IP) in its proprietary Space Alternated Phase Shift (SAPS™). SAPS can accomplish cleaner than conventional megasonic cleaning processes, without loss of material and roughing wafer surfaces, according to ACM Shanghai. 

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