German equipment company Manz AG promotes new packaging technology FOPLP to Chinese automotive chips suppliers German equipment manufacturer Manz AG showcased its adavanced packaging solution - FOPLP (Fan-Out Panel Level Packaging) - at the SEMICON China 2023 held in Shanghai earlier this month. 2.1w 07-13 16:08 READ MOST 我国授权纳米专利总数达46.4万件 居世界第一 6774 08-30 21:46 POPULAR TAGS 纳米 中科院 专利
