German equipment company Manz AG promotes new packaging technology FOPLP to Chinese automotive chips suppliers German equipment manufacturer Manz AG showcased its adavanced packaging solution - FOPLP (Fan-Out Panel Level Packaging) - at the SEMICON China 2023 held in Shanghai earlier this month. 2w 07-13 16:08 READ MOST 北京多所高校禁用罗马仕充电宝 公司致歉：若有缺陷将依法担责 1w 06-15 13:15 POPULAR TAGS 罗马仕 安全 充电宝
