Fudan University, one of the best Chinese universities for microelectronics in Shanghai, recently signed an agreement to build a joint laboratory on intelligent computing chips with Biren Technology, a cloud computing chip startup.

According to the announcement, the joint lab will focus on innovating IC design, computing architecture, and new packaging technology applications. It will also train talents in related fields, contributing to more breakthroughs in China’s computing industry.

Liu Ming, the dean of the Frontier Institute of Chip and System, Fudan University, said there is considerable space to combine Biren Technology’s specialty and Fudan University’s research directions. The joint laboratory could become a new bridge between academia and the IC industry in China.

Founded in 2019, Biren Technology completed series A funding with RMB1.1billion ($172 million) in the 9th month after its setup, a financing record for chip startups in recent years. It now has a total of RMB4.7 billion ($723 million) funding. The company develops original universal computing systems, related software, and hardware platforms for intelligent computing.

Zhang Wen, founder and CEO of Biren Technology, has a New York-based lawyer background, with rich experience in private equity fund management, which is different from most of his counterparts in other chip startups. He holds a doctorate in law from Harvard University and an MBA degree from Columbia University.

In 2011, he returned to China and joined Enraytek (映瑞光电科技)，a LED chip company, helping scale it up. He previously served as president of SenseTime (商汤科技), a well-known Chinese AI company.