Editing by Kate Yuan

The IC industry in northern China's coastal city Tianjin surged 56.3% in 2021, generating an output value of RMB33.3 billion ($5.3 billion), with several major production and renovation projects starting construction or having completed, according to the local Tianjin Daily.

Tianjin implemented 78 projects in electronics manufacturing in the past year with an investment of RMB12.9 billion ($2.0 billion), up by 26% year on year. The city achieved a cumulative output value of RMB184.7 billion ($29.2 billion) in electronics manufacturing in 2021, with a 9.1% growth in added value.

An official from the Tianjin Industrial and Information Technology Bureau said that several projects started construction including Lenovo’s Innovation Industry Park, SMIC’s T3 production line, Samsung Electro-Mechanics’ MLCC intellectual reform, silicon wafer, and 6-inch chip expansion of Zhonghuan Semiconductor’s subsidiaries, and NXP’s production expansion. 

The official said the city’s IC industry will head for an RMB40 billion ($6.3 billion) scale by the end of 2022. 

The completed and operating projects also include Hwatsing’s machine for chemical mechanical polishing, NXP’s testing center, and Linxens’ factory.

AccoTEST’s testing base and Photonicwave’s laser chips have been completed. In addition, Tianjin Xinhuo Innovation Base won RMB30 million ($4.8 million) funding from the central government. 

In 2022, Tianjin will strive to build China’s leading IC industry base and is expected to invest 46 projects with RMB15 billion ($2.4 billion) in electronics manufacturing, hitting an output value of RMB200 billion ($31.7 billion). 

Tianjin will rely on major projects including SMIC’s Phase II to build seven clusters of IC manufacturing, equipment, materials, and design in three districts, added Tianjin Daily. 

Five major ecosystem alliances for its IC innovation will be set up to focus on leading enterprises such as SMIC, Vanchip, Zhonghuan Semiconductor, Phytium, and NXP to attract companies from other provinces.