By Miranda Li

Northeast China's Liaoning Beststar Semiconductor Technology (辽宁百思特达半导体) is in the final stage with project commissioning of power equipment, water storage system, and air compressor, and will go into official production after a two-month pilot run, the local Panjin Daily reported.

Source: Panjin Daily

The company will have processing equipment debugging, production line verification, and personnel stationing in late May. 

The company invested a total of RMB300 million ($44.16 million) in the GaN(gallium nitride) semiconductor chip project, which covers an area of 125 acres, with a construction area of more than 50,000 square meters. 

Settled in Panjin High-tech Zone in early October 2019, the project includes two GaN epitaxial wafer and semiconductor fabs, one chip packaging and product manufacturing line with a warehouse, hydrogen production station, and one R&D center.

The project also has a designed capacity for additional ten GaN epitaxial production lines with an annual production capacity of 100,000 GaN epitaxial wafers and one billion GaN chips.