The joint venture of China’s leading packaging company TF Microelectronics and U.S. AMD in Malaysia expands its facilities and will complete in 2023
Chinese article by 李沛
English Editor 张未名
06-16 16:47

By Li Panpan

China’s leading packaging company, TF Microelectronics (通富微电) has a joint venture in Malaysia with the U.S. chip giant AMD called TF Microelectronics Sdn Bhd, which plans to expand its manufacturing facility with nearly RM2 billion ($454.7 million) of investment, the local press reported.

The joint venture’s managing director and vice-president Neoh Soon Ee said the new facility at the Batu Kawan Industrial Park would be its second site in Penang and is expected to be completed in 2023. It will create more than 3,000 jobs in advanced semiconductor engineering, design, and process technologies for high-performance computing solutions. 

The new facility spans 139,000 square meters and occupies about 5.66 hectares. It will bring the company’s total manufacturing capacity to over 210,000 square meters once completed, according to a press conference on June 14.

Founded in 1997 and listed on the Shenzhen Stock Exchange in 2007, TF Microelectronics is headquartered in Nantong of eastern China’s Jiangsu Province.  

TF AMD Microelectronics is a joint-venture company established in 2016. In the same year, TF Microelectronics spent $370 million acquiring 85% of AMD’s stake in two locations—AMD in Penang, Malaysia, and AMD Suzhou of Jiangsu.

AMD executive vice-president Datuk Devinder Kumar said TF AMD played a key role as a strategic supplier and partner in supporting AMD’s growth. 

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