By Greg Gao

Capcon(华封科技), a Chinese advanced semiconductor assembly and packaging firm, raised $50 million in Series B2 financing round recently. The funds will be mainly used for factory investment, marketing and R&D expending, JW Insights learned. 

Investors in this round include leading VCs like Cowin Capital(同创伟业), Chengchuang Capital(承创资本), Hillhouse Capital(高瓴资本), and Shangqi Capital(尚颀资本). Previously, Capcon had received investment from Bank of China International(中银国际), Oriza Holdings(元禾璞华), INTEL, and other institutions. 

Registered in Hong Kong in 2014, Capcon is a high-end IC assembly and packaging technology supplier. The company operates in Beijing, Suzhou, Kaohsiung, and Singapore.

Capcon has launched a 2060W-wafer level bonder, which can be applied to info, COWOS, M-Series, EWLB semiconductor packaging processes, according to Cowin Capital.

The company has served nearly 30 customers, including top-tier semiconductor packaging firms ASE, SPIL, NEPES, and TongFu Microelectronics. Capcon is also preparing for its next round of financing.