By Kate Yuan

(JW Insights) Apr 17 -- FII (Foxconn Industrial Internet工业富联), the Shenzhen-based subsidiary of Hon Hai, bought ASE Group’s four Chinese mainland packaging and testing plants, and plans to package third-generation semiconductors for vehicles with them, Taiwanese Central News Agency (CNA) reported on April 11.

FII will plan the four facilities with KoreSemi (青岛新核芯), a Qingdao of eastern China’s Shandong Province-based company Hon Hai invests in. In addition to system-in-package, chiplet and MEMS packaging, the four facilities will target power component packaging including auto SiC and IGBT, an industry insider told CNA.

In December 2021, chip packaging giant ASE Group sold to Wise Road (智路资本) its subsidiary GAPT Holding Limited, which directly or indirectly held 100% equity of Global Advanced Packaging Test (Hong Kong), and companies in Shanghai, Shandong’s Weihai, eastern China’s Suzhou City and Kunshan City. In June last year, reports said that FII had teamed up with Wise Road to acquire the above four packaging and testing plants in the Chinese mainland.

FII has actively deployed its businesses in semiconductor design services, packaging and testing, and testing equipment.

Hon Hai would actively build its own semiconductor production capacity in the future, and become the first EMS and automotive subsystem provider, said Hon Hai Chairman Liu Young at last year's annual shareholders meeting.