By Greg Gao

(JW Insights) Jun 12 -- China’s leading foundry Hua Hong Semiconductor (华虹半导体) held a signing ceremony for its Integrated Circuit R&D and Fabrication Base Phase II Project in Nanjing, eastern China’s Jiangsu Province, on June 8, according to Xinhua News.  

Jiangsu Province’s Governor Xu Kunlin and Zhang Suxin, Chairman of Hua Hong Semiconductor, attended the signing ceremony. Xu welcomed Zhang Suxin and his delegation to deepen cooperation in Jiangsu and congratulated them on signing the new project.

Jiangsu has cultivated the integrated circuit industry as an advanced manufacturing cluster and advantageous industrial chain, having become an important production base in China, Xu added.

“We hope that Hua Hong will combine its own advantages in semiconductors with those in Jiangsu’s industrial, scientific, educational, and talent areas, to the growth of related companies in Jiangsu. We also hope to collaborate in undertaking more key core technology R&D projects related to China’s national major needs, synergestically improve the level of technology commercialization and industrialization, and jointly create a favorable ecosystem for the integrated circuit industry,” said Xu.

Zhang Suxin thanked Jiangsu for its strong support. He stated that Jiangsu has abundant innovative resources, a solid industrial foundation, and a favorable business environment, making it a key region for Hua Hong’s strategic layout.

Founded in 1996 and based in Shanghai, Hua Hong Semiconductor was listed on Hong Kong Stock Exchange in 2014. The company currently has three 8-inch wafer fabs in Shanghai. It also has a leading 12-inch wafer fab in Wuxi of Jiangsu Province.