By Greg Gao

(JW Insights) Jun 21 -- Xincheng Semiconductor(芯承半导体), a provider of integrated circuit packaging substrate solutions, held a commissioning ceremony for its new plant with a total investment exceeding RMB3 billion($417 million) in Zhongshan, southern China’s Guangdong Province, on June 19.

The first phase of investment amounts to RMB1 billion($139 million), while the second phase will be RMB2 billion($278 million). Currently, the first phase of the project has been put into production with secured customer orders.

In October 2022, Xincheng Semiconductor's high-density flip chip project entered the equipment installation and debugging stage. It was revealed that the company would leverage the project to establish a high-density flip chip packaging substrate production factory in Sanjiao Town, Zhongshan. 

The plant would integrate three processes: MSAP (Modified Semi-Additive Process), ETS (Embedded Trace Substrate), and SAP (Semi-Additive Process). 

Established in 2022 and based in Zhongshan, Xincheng Semiconductor is an integrated circuit packaging substrate startup. The company has already completed angel, Pre-A, and A+ rounds of financing, with a total funding of hundreds of millions of RMB.