By Li Panpan

(JW Insights) Sep 28 -- The 2023 Automotive Semiconductor Ecosystem Summit (ASES) and Global Automotive Electronics Expo was staged in Shenzhen of southern China's Guangdong Province on September 26 - 27.

The third annual event carried the slogan "Build up new chip supply chain, manufacture smarter vehicles.”

The main sponsor of this year's event was Guangdong Provincial Department of Industry and Information Technology, Shenzhen Municipal Bureau of Industry and Information Technology, and China Energy and Automobile Media Group and hosted by China Automotive News.

JW Insights was co-organizer. There were over 20 seminars, analyst conferences, panel discussions and other activities at ASES, connecting various players in the industry.

Yang Xudong, deputy director of the Electronic Information Department of the Ministry of Industry and Information Technology (MIIT), said the government will continue to guide companies to increase technological research on automotive chips and promote the improvement of production line manufacturing capabilities.

Chen Huaping, deputy director of the Shenzhen Municipal Bureau of Industry and Information Technology, said Shenzhen's automobile industry has ushered in an explosive development. The city's automobile production has increased from 99,900 vehicles in 2018 to 848,800 vehicles in 2022, an increase of more than seven times.

Xin Ning, general manager of China Energy and Automobile Media Group and president of China Automotive News, pointed out that the production relations of the automobile industry can no longer adapt to the development requirements of new productivity. Its reconstruction is a topic that the automobile industry must face when seeking transformation or achieving new development.

Yan Gang, executive deputy director of the National Innovation Center of Intelligent and Connected Vehicles, addressed the grand session.

Speakers from automotive brands were Xi Zhongmin, deputy general manager of GAC Aion; Wu Baojun, president of Leapmotor; Yang Hong, president of HSAE.

Semiconductor technology and suppliers were another group of speakers. They included Sun Gang, vice president of product marketing from Qualcomm China; Lei Jianmei, a deputy general manager from China Automotive Engineering Research Institute; Liu Qi, general manager of the automotive division of OmniVision Group; Li He, vice president of Beijing Ingenic; Li Dongyue, head of Nexperia BG MOS China; and Geng Qiangcheng, co-founder and president of ThunderSoft.

Financial and investment company represntatives spoke at the session. They were Cao Xiang, Geely Capital CEO; Gong Xi, a director from Great Wall Capital,

A roundtable on the theme of "capital assists the rapid development of the automobile industry chain" attracted the audience with insights on investment trends.

China Automobile News, China Automotive Technology and Research Center Co., Ltd., and JW Insights jointedly compiled "China Automotive Semiconductor Industry Development White Paper." It was released at the Grand Session.

Han Xiaomin, general manager of JW Insights' Consulting Division, said the white paper sorts out the Chinese automotive semiconductor industry chain and helps improve the understanding of industrial ecosystem.

The White Paper also deals with not only product technology, but also shows the changes in the competitiveness of Chinese automotive semiconductor companies through multi-dimensional analysis, such as patent layout.