Editing by Xin Lanhua

The world’s leading engineering simulation software provider Ansys donated recently some industry-leading computer-aided engineering (CAE) and electronic design automation (EDA) softwares to Tsinghua University’s School of Integrated Circuits.

According to the school’s information, the donated softwares are Ansys’ latest product series, which are available on the school’s EDA platform now. They will greatly benefit students and teachers for their training and research in chip design, packaging and testing, and electronic systems.

Source: School of Integrated Circuits of Tsinghua University

This donation is part of the cooperative memorandum that Tsinghua University and Ansys have signed previously. Both sides agree to cooperate in IC teaching, research, and training, optimize the IC-related curriculum system integrating teaching and research to production.

Tsinghua University’s School was officially established in April this year to train more IC talents.

ANSYS’ donations are related to softwares in electromagnetic field, microwave, antenna, structure and fluid, optoelectronic component, chip packaging, electrothermal multiphysics and 3D IC, SoC power noise and reliability, RTL power analysis and optimization, thermal analysis, ESD analysis, power model analysis and extraction.

Listed on NASDAQ, ANSYS Inc. (安似科技) was established in 1970. It focuses on CAE/EDA engineering simulation, providing multi-domain and multi-physics and coupled simulation technology, products and solutions for numerous fields.