Editing by Li Panpan

HK-registered Capcon (华封科技) is a black horse in the global advanced semiconductor assembly and packaging equipment supplier, winning top-tier clients after its seven-year development. It received “The IC Unicorn of the Year Award” from the China Semiconductor Investment Alliance (CSIA) and JW Insights last December.

Registered in Hong Kong in 2014, Capcon operates in Beijing, Suzhou, Kaohsiung, and Singapore. It offers innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Panel-Level Die Bonder, Multi-Chip Die Bonder.

According to the Chinese press, Capcon has won a good reputation among global packaging companies like ASE, SPIL, TSMC, AMD, TFME, JCET, and DeeTee with its high-precision, high-speed, high-reliability products. It is one of the top three equipment suppliers in the advanced semiconductor assembly and packaging industry.

Wang Hongbo, cofounder of the company, said in a recent interview with JW Insights that his company eyes on the rapidly growing Chinese mainland market and will introduce globally top-notch technology into the market to enhance the security of the equipment supply chain. It has gained fourteen clients since it expanded its business in the Chinese mainland last March.

At Semicon China in Shanghai last year, it demonstrated its flagship product 2060W of C2W high precision wafer-level packaging placement machine. It sold well in Taiwan to global leader  ASE, which placed additional orders at the end of the year.

At a Shenzhen SiP exhibition in the second half of last year, Capcon introduced to the Chinese mainland its 2060M the latest multi-chip placement machine the SiP market, which can support up to 8 loading modes at the same time, support chip, discrete devices for high-precision packaging on the same device. Now Chinese mainland’s leading player is using it on trial and in the middle of placing orders.

Wang said 2022 would be “a year of eruption” for the advanced semiconductor assembly and packaging industry. His company has three R&D goals: One is to develop sub-micron ultra-high precision Hybrid bonding equipment for the international high-end market, another is to create mid-end 1060 series products for the Chinese mainland market, and the last is to develop Panel-Level packaging equipment with significant future potential.

Wang admitted that the pandemic had affected Capcon’s operation, especially with international travels on hold. Its Singapore operation was suspended for three months last year, but it managed to complete building its production base in Suzhou.