By Li Panpan

(JW Insights) Sep 25-- A master’s student of Xiamen University’s School of Electronic Science and Engineering won the first prize in the 2023 IEEE ICEPT Best Student Paper Award recently, JW Insights learned. The paper is entitled “Fine Pitch Wafer-to-Wafer Hybrid Bonding for Three-Dimensional Integration” by Jiang Xiaofan.

The 2023 International Conference on Electronic Packaging Technology (IEEE ICEPT 2023) was held at Shihezi University in Xinjiang, northwestern China, from August 9 to 11 this year.

The conference received a total of 750 paper submissions and accepted 499 papers, setting a record for the highest number of submissions and acceptance rate in all previous ICEPTs.

Contributed papers come from researchers from Chinese and international scientific research institutes and IC companies.

The School of Electronic Science and Technology of Xiamen University said hybrid bonding technology has received significant attention from the industry because it can achieve ultra-high-density chip stack interconnection. Jiang’s paper investigates a fine-pitch hybrid wafer bonding technology designed for heterogeneous integration applications to achieve high-density interconnects and improve electrical performance through the bonding of copper and SiO2 wafers.

ICEPT has been recognized as one of the top four electronic packaging academic conferences, which is hosted by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) and Shihezi University. It’s co-organized by the IEEE Electronics Packaging Society (IEEE-EPS) and has been held in China every year since its inauguration in 1994.