By Kate Yuan

Chinese digital imaging chip company OmniVision released the world's first product-level CIS/EVS fusion vision chip OV60B10 on August 6, integrating two types of sensors and enhancing their capabilities, the company said in its press release.  

OmniVision states that OV60B10 gives play to both the event camera which can efficiently capture scene changes with low latency and low data volume, and CIS (CMOS Image Sensor) with high resolution and large pixel. The chip is suitable for ultra-high-speed image reconstruction, high-dynamic-range imaging, ADAS, smart cockpit, eye tracking, object tracking, and SLAM.

OV60B10 is made by the 3D Stack process, which integrates CIS, EVS, ISP/ESP into the state with the best performance and the smallest volume. Its two sensors share the focal plane with multiple signal interactions, enabling the match with high precision in time and space.

The chip also adopts OmniVision's exclusive in-pixel timestamp and related high-speed readout technology, which can greatly improve EVS’ timing accuracy and reduce timing jitter, the company said.

Founded in 1995, OmniVision Technologies is a leading developer of advanced digital imaging, analog, and touch & display solutions. Its products are widely used in mobile phones, security, automotive electronics, wearable devices, IoT, communications, computers, and consumer electronics.