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Chinese IC design house Montage Technology announces the successful tape-out of its first-generation AI chip
Chinese article by 爱集微
English Editor 张未名
01-12 17:05

By Greg Gao

The listed Chinese IC design house Montage Technology(澜起科技) completed the tape-out by the end of 2022 its first-generation AI chip as scheduled and will carry out a series of tests, verification and sample delivery next. The company announced on its investor relationship management platform on January 10.

Montage Technology’s interconnect chips currently in mass production and under research include: memory interface chips (RCD, DB, MCR RCD, MCR DB), memory module supporting chips (SPD, TS, PMIC), PCIe Retimer Chip, CXL memory expansion controller chip (MXC), DDR5 clock driver (CKD).

The company also steadily upgrades existing products and further improves the product portfolio, said the company.

Its PCIe 5.0/CXL 2.0 Retimer chip has successfully achieved mass production. This chip is a key upgrade of the company’s existing PCIe 4.0 Retimer products, which can provide customers with a stable and reliable high-bandwidth, low-latency PCIe 5.0/CXL 2.0 interconnection solution.

The company is actively participating in the standard formulation of the first-generation MCR RCD/DB chip organized by the semiconductor standardization body JEDEC, and is carrying out R&D of related products as planned. Montage’s goal is to complete the R&D work of the mass-produced version of the MCR RCD/DB chip and deliver it by the end of 2023.

Founded in 2004 and listed on the STAR market of the Shanghai Stock Exchange in 2019, Montage is a Shanghai-based IC design company providing high-performance and low-power IC solutions for cloud computing and data center markets. Its products include memory interface chips, server central processing units, and hybrid safety memory modules.

The company was founded by Howard C Yang, who has been recognized as a member of IEEE Life Fellow for his remarkable contributions to the IC design field and his sustained commitment to IEEE in November 2022.

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