Chinese advanced packaging startup KiwiMoore calls on more chip design houses to adopt Chiplets, creating a more mature ecosystem
Chinese article by 赵月
English Editor 张未名
01-28 17:37

By Greg Gao

Chinese semiconductor advanced packaging service provider KiwiMoore (奇异摩尔) expressed energetic support to the Chiplets technology and called more chip companies join the track to make the entire Chiplets ecosystem more mature and stable, JW Insights reported recently.

According to market research firm Gartner’s forecast, the sales revenue of Chiplet-based semiconductor devices will increase from $3.3 billion in 2020 to $50.5 billion in 2024, with a compound annual growth rate of 98%. In recent years, a number of excellent Chiplets technology providers have emerged in China, and KiwiMoore is one of them. It was founded in 2021 and based in Shanghai.

As a pioneer focusing on 2.5D and 3DIC Chiplet products and services, KiwiMoore seized this opportunity and achieved remarkable results in 2022. It was one of the first batches of Chinese companies to join the UCIe Consortium (Universal Chiplet Interconnect Express).

Its other major business areas cover next-generation data centers, autonomous driving, and personal computing platforms. Its forward-looking industry vision and design strength in the Chiplet field have been widely recognized by the industry players, said the JW Insights report.

KiwiMoore completed the round of angel financing and secured RMB100 million($14.74 million). It said it will continue to increase investment in R&D teams, and steadily improve its design capabilities.

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