By Greg Gao

Xpeedic(芯和半导体), a leading provider of simulation-centric EDA solutions, released Notus, an electronic design automation (EDA) platform for package/board SI/PI/thermal analysis, at DesignCon 2023 in Santa Clara, Calif on February 1. It also announced upgrades to its Advanced Packaging and High-Speed Digital Solutions, according to Xpeedic.

Founded in 2010, Xpeedic has offices in both Silicon Valley, US, and Shanghai and Suzhou, China.

Notus, powered by Xpeedic’s electromagnetic and multiphysics solver engine, helps designers to meet the SI, PI, and thermal requirements in a more efficient and automated way. It provides a comprehensive simulation flow including DC IR-drop, AC impedance, decoupling capacitor optimization, signal topology extraction, signal interconnect modeling, and thermal analysis, said the company.

In addition to Notus, Xpeedic also announced upgrades to its Advanced Packaging and High-Speed Digital Solutions.

Metis, Xpeedic’s EM simulation tool for 2.5D/3DIC advanced packaging designs, now delivers further improvement in performance. The speed-balanced-accuracy multi-mode is enhanced to achieve optimal accuracy-speed tradeoff. Hermes, Xpeedic’s 3D EM simulation tool, further improves its adaptive mesh technology to achieve the desired accuracy with faster convergence. ChannelExpert, the diagram GUI-based circuit simulation platform, provides a fast, accurate, and simple approach to analyzing high-speed channels.

Its differentiating chip-package-system solution enables customers to shorten their design cycle and thus improve time to market. Xpeedic customers include the world’s top companies in mobile, IoT, HPC, data centers, and automotive.