By Gabby Chen
(JW Insights) Mar 6 -- Honor, the Chinese smartphone brand spun off from Huawei, launched its first self-developed RF enhancement chip Honor C1 at its March 6 new product release event of Honor Magic5 series.
Fang Fei, president of Honor's product line, said that this new C1 chip will significantly improve network communication experience, even in weak signal areas.
The Honor C1 chip has an optimized algorithm for traditional weak signal situations, including in garages, basements and elevators. It can provide smooth video viewing and better 5G experience even on Beijing's high-speed moving subway with frequent switching of cell towers, said Honor.
It is reported that its R&D team has grown to 8,000 people, which has doubled compared to 4,000 people when it spun off from Huawei.
Qualcomm denies rumor of “large-scale” layoffs in its Shanghai R&D center09-25 15:33
China’s high-end power device supplier Dexin Chip commences $684.73 million project09-25 11:10
China’s power IC supplier Dongke Semiconductor and Peking University launch Joint R&D Center on Third-Generation Semiconductor09-21 12:02