(JW Insights) April 11 -- Chinese fabless chipmaker Loongson (龙芯中科) launched the new 3D5000 processor for data centers and cloud computing at a technology summit held in Hebi, central China’s Henan Province on April 8.

The company claimed its 32-core domestic chips deliver over 1 TFLOPs of FP64 performance, up to 4X higher than regular Arm cores.

The 3D5000 still leverages LoongArch, Loongson's homemade instruction set architecture (ISA) from 2020.

The 3D5000 flaunts a chiplet design since Loongson has glued together two 16-core 3C5000 processors. Loongson developed the 3C5000 server part to compete with AMD's Zen and Zen+ architectures, said a report from Tom’s Hardware on April 9.

The chip also has its Trusted Platform Module (TPM), so it doesn't rely on an external solution. In addition, the 3D5000 also supports a secret national algorithm with an embedded security module that seemingly delivers excellent encryption and decryption efficiency higher than 5 Gbps.

The Tom's Hardware report added that Loongson's 3D5000 is no match for AMD's EPYC Genoa or Intel's Sapphire Rapids Xeon processors. It was never about beating the foreign competition but pushing for self-sufficiency. Unfortunately, with the ongoing U.S. sanctions, Chinese companies have no means to secure chipmaking tools originating from the U.S.

(Li PP)