Chinese semiconductor equipment provider QUICK plans to invest RMB1 billion($144 million) in IC packaging equipment project
Chinese article by 刘沁宇
English Editor 张未名
05-09 19:38

By Greg Gao

(JW Insights) May 9 -- QUICK Intelligent Equipment(快克智能), a Chinese semiconductor equipment provider, plans to invest RMB1 billion($144 million) in a semiconductor packaging equipment R&D and manufacturing project in Wujin, eastern China’s Jiangsu Province, announced the company on May 8.

The company signed an agreement with the Management Committee of Wujin National High-tech Industrial Development Zone for the project, covering an area of about 68 acres.

While responding to China’s national policy guidelines and implementing QUICK’s strategic planning, the project is expected to create a more complete set of semiconductor packaging solutions, according to the company.

Established in 1993 and based in Wujin, Changzhou city, eastern China’s Jiangsu Province, QUICK Intelligent Equipment specializes in intelligent equipment for packaging and detection of precision electronic assembly semiconductors.

The Company’s main businesses include a variety of connected equipment, professional industrial robots, and automated production lines during the manufacturing process. It provides services for the industries such as intelligent devices, new energy, intelligent IOT, and semiconductors.

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