By Kate Yuan

(JW Insights) Jun 26 -- TSMC held its annual tech forum in Shanghai and launched its latest N3AE and N3A processes for automotive chips as well as N4PRF process for RF, reported the Taiwanese Economic Daily News on June 21.

TSMC has launched the Automotive Design Enablement Platform (ADEP) in the past three years, providing N7A and N5A processes to facilitate clients’ innovation in the automotive sector. The N3AE, or “Auto Early”, which offers automotive process design kits (PDKs) based on N3E, will allow auto semi suppliers to start earlier on new chip designs, said TSMC.

The N3E process will bring about a 5% performance improvement compared to N3, while the subsequent N3P process will bring about a 4% density improvement and a 10% performance improvement compared to N3E.

Autonomous driving has driven the increasing demand for computing power, which requires the latest logic technology. TSMC expects 90% of cars to have advanced driver assistance systems (ADAS) by 2030, with L1, L2, and L2+/L3 reaching 30% market share each.

This Shanghai forum aims to further strengthen TSMC's cooperation with companies in the Chinese mainland and reduce the impact of external factors including new US regulations, according to the Taiwanese newspaper.