By Li Panpan

(JW Insights) Jul 11 -- Chinese EDA solution provider Xpeedic (芯和半导体) launched its high-speed digital signal integrity and power integrity (SI/PI) suite on July 10 at the 60th Design Automation Conference (DAC) held in San Francisco from July 9 to 13.

The new product by the Shanghai-based company offers new features and upgrades to advanced packaging and high-speed design domains.

Last month Xpeedie released its 2023 RF EDA solutions at the International Microwave Exhibition (IMS). It released the rest of its 2023 EDA suite, including 2.5D and 3D signal integrity and power integrity simulation for advanced packaging, along with three platforms to support 3D Electromagnetic (EM) simulation, multi-domain co-simulation and high-speed system simulation.

Founded in 2000, Xpeedic is a leading provider of simulation-centric EDA solution. Its differentiating chip-package-system solution enables customers to shorten their design cycle and thus improve time to market. Its customers include the world’s top companies in mobile, IoT, HPC, datacenter, and automotive, said its website.

The Design Automation Conference (DAC) is recognized as the premier event for the design and design automation of electronic chips to systems. It is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM's Special Interest Group on Design Automation (SIGDA) and IEEE's Council on Electronic Design Automation (CEDA).