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China tops in the papers accepted by ISSCC
Chinese chip startup Nano-Core Chip(微纳核芯)'s three AIoT chip design results were accepted by the 2023 International Solid-State Circuits Conference.
The ISSCC announced the list of accepted papers, among which China ranked first, surpassing the former top-placed US, JW Insights quoted a Nikkei Asia’s report on November 20.
A Chinese team from Fudan University in Shanghai proposed COMB-MCM, a Computing-In-Memory (CIM) AI chip at ISSCC 2022, a global solid-state circuits forum
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