By Greg Gao

China’s universities and companies have submitted the most research papers accepted at the renowned international semiconductors academic conference - International Solid-State Circuits Conference (ISSCC) 2023. The country’s two prestigious Tsinghua University and Peking University contributed 13 and six papers, respectively.

The 70th ISSCC was held in San Francisco, USA, from February 19 to 23. Began in 1953, The ISSCC is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. It offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts.

The ISSCC 2023 accepted a total of 198 papers, and the total number of papers from the Chinese mainland, Hong Kong and Macau are 59, ranking first in the world for the first time.

Other top universities in China have also made remarkable contributions to the conference. Five papers from the University of Electronic Science and Technology of China, three papers from Southeast University, three from Fudan University, and three from Zhejiang university are accepted at the conference.