By Gabby Chen

(JW Insights) Mar 16 --Jingneng Microelectronics (晶能微电子), the chip unit affiliated with Chinese auto giant Geely, has completed the tape-out of its first self-developed automotive IGBT chip, with all parameters meeting the design requirements, the company announced on March 16.

The new IGBT chip adopted the latest seventh-generation IGBT technology. By optimizing the surface and FS (field stop) structure, it has both short-circuit tolerance and lower conduction/switching losses, which has increased the power density by 35%, said the company, based in Hangzhou of southeastern China’s Zhejiang Province.

Founded in 2022, Jingneng Microelectronics concentrates on developing automotive IGBT chips and modules, SiC devices, and low- and medium-voltage MOSFETs. The company has the comprehensive capability of “chip design + module manufacturing + vehicle certification,” supplying markets such as NEVs, electric motorcycles, photovoltaics, and energy storage.

In addition, Jingneng closed its Pre-A fundraiser in December 2022 to support its R&D of power semiconductor modules, production, and technical team expansion. The fundraising, led by venture capital firm Walden International, attracted investors including Vision Knight Capital, Gaorong Capital, and Volfone Enterprises, according to the JW Insights report.