By Greg Gao

(JW Insights) Jun 20 -- JCET Group(长电科技), the largest Outsourced Semiconductor Assembly and Test (OSAT) company in China’s mainland, has developed a high-density heterogeneous integrated SiP solution for 5G RF power amplifiers, which is soon to enter mass production, JW Insights learned recently.

Jin Yujie, vice president of JCET said that the company recognizes the rapid penetration of SiP packaging technology into high-end smartphones, smart wearables, smart homes, industrial automation, and high-performance computing systems. JCET will continue introducing SiP chip final manufacturing and testing solutions aligning with corresponding applications.

RF power amplifier modules are widely used in various devices such as smartphones, tablets, wireless routers, and smart wearable devices. With the advent of 5G, these modules require higher power, operating frequencies, larger bandwidth, and smaller module sizes.

JCET’s high-density heterogeneous integrated SiP solution offers significant advantages in high integration density and yield rate. By optimizing process flows and upgrading auxiliary fixtures and equipment, the solution achieves a module density that is 1.5 times higher than the previous generation, according to the company.

The company’s validation and testing platform covers RF microwave, millimeter-wave, 5G cellular, and wireless communications. It supports experimental verification from chip, packaging, and module to final product, serving as an integral part of the solution.

Founded in 1972 and listed on Shanghai Stock Exchange in 2003, JCET Group is based in Jiangyin, eastern China’s Jiangsu Province. It offers a full range of turnkey services, including semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, and final test for a global client base.