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  • US chip giant Intel appoints former Chinese packaging company JCET CTO as general manager of its packaging and testing department

    Intel recently announced internally that Lee Choon Heung (Li Chunxing) would take over as the general manager of its packaging and testing department.

    3w ijiwei
    11-06 18:15
  • China’s leading OSAT company JCET Group achieves high-volume packaging of 4-nanometer chips by leveraging Chiplet technology

    JCET leverages Chiplet technologies to achieve high-volume production of packaging for 4 nm chips

    2.3w ijiwei
    08-04 15:38
  • JW Insights: China's packaging and testing industry has not bottomed out yet in Q2, faced with weaker market demands

    China's packaging and testing industry has not shown signs of bottoming out, although there were improved order volumes in the second quarter of this year.

    1.9w ijiwei
    07-28 17:01
  • Gartner: Three Chinese fabs are in the top seven both in 2021 and 2022 by OSAT revenue worldwide

    Chinese JCET, TF Microelectronics, and HT Tech were in the top seven in 2021 and 2022 among the top 25 list of OSAT(Outsourced Semiconductor Assembly and Test ) semiconductor companies by revenue.

    1.8w ijiwei
    07-27 15:16
  • JW Insights releases profile of listed Chinese semiconductor company executives

    Nvidia’s GPU chips have met golden market opportunities, especially in China, with the development of AI large-language models like ChatGPT. Chinese GPU suppliers are working hard as well to try to remodel the market structure.

    3.1w ijiwei
    06-22 22:17
  • China’s largest OSAT company JCET will soon start mass production of high-density heterogeneous integrated SiP solution for 5G RF power amplifiers

    JCET launches new SiP solution for 5G RF power amplifiers

    1.3w ijiwei
    06-20 17:19
  • JW Insights: China’s packaging and testing industry suffers from low profits

    Chinese packaging and testing manufacturers are suffering in meager profits due to sluggish market demand and production overcapacity, said a recent JW Insights report analyzing 16 major manufacturers.

    2.3w ijiwei
    05-29 23:47
  • Chinese leading packaging company JCET adopts Chiplet technology to achieve high-volume packaging of 4-nanometer chips

    JCET, a leading Chinese provider of IC back end manufacturing and technology services, announced that it has achieved high-volume integrated packaging for 4-nanometer chips.

    3.7w ijiwei
    01-13 15:03
  • Chinese leading packaging company JCET starts mass production of its unique XDFOI Chiplet series

    Chinese OSAT giant JCET’s unique XDFOI Chiplet series packaging technology achieves mass production

    1.6w ijiwei
    01-09 17:57
  • Chinese chip companies SMIC and JCET are listed in China’s top 100 digital economy in 2022

    Chinese chip companies SMIC(中芯国际) and JCET(长电科技) are in the List of Top 100 Chinese Digital Economy in 2022 released by Forbes China and China Electronics Chamber of Commerce recently.

    2.2w ijiwei
    08-24 17:48

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      1w ijiwei
      06-15 13:15

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