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Intel recently announced internally that Lee Choon Heung (Li Chunxing) would take over as the general manager of its packaging and testing department.
JCET leverages Chiplet technologies to achieve high-volume production of packaging for 4 nm chips
China's packaging and testing industry has not shown signs of bottoming out, although there were improved order volumes in the second quarter of this year.
Chinese JCET, TF Microelectronics, and HT Tech were in the top seven in 2021 and 2022 among the top 25 list of OSAT(Outsourced Semiconductor Assembly and Test ) semiconductor companies by revenue.
Nvidia’s GPU chips have met golden market opportunities, especially in China, with the development of AI large-language models like ChatGPT. Chinese GPU suppliers are working hard as well to try to remodel the market structure.
JCET launches new SiP solution for 5G RF power amplifiers
Chinese packaging and testing manufacturers are suffering in meager profits due to sluggish market demand and production overcapacity, said a recent JW Insights report analyzing 16 major manufacturers.
JCET, a leading Chinese provider of IC back end manufacturing and technology services, announced that it has achieved high-volume integrated packaging for 4-nanometer chips.
Chinese OSAT giant JCET’s unique XDFOI Chiplet series packaging technology achieves mass production
Chinese chip companies SMIC(中芯国际) and JCET(长电科技) are in the List of Top 100 Chinese Digital Economy in 2022 released by Forbes China and China Electronics Chamber of Commerce recently.