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KiwiMoore calls on more chip design houses to adopt Chiplets
BT Substrate Enables Progress of Advanced Packaging
“Why Advanced Packaging Materials Matter?” gives insights in two parts on this new frontier of semiconductor technology developments.
Major Chinese IC packaging companies have stepped into advanced packaging—FCBGA in particular, but need to survive the current market downturn, said a JW Insights article.
Huawei’s rotating chairman Guo Ping explained Huawei’s IC strategy facing the blockade by the U.S. sanctions, saying it expects to make breakthroughs in advanced packaging at Huawei’s 2021 annual performance conference.
The Post-Moore era brings excellent potential to the packaging and testing industry. China’s JCET(长电科技) Group will continue to lead advanced packaging development.
JW Insights talked to Risto Puhakka, president of VLSIresearch, about Moore’s Law through advanced packaging.