There are about 446 related results
There are about 446 related results
Panasonic’s head Kazuhiro Tsuga affirmed the company's strategic commitment to China's market
Chinese integrated circuit packaging and testing services provider Forehope Electronic announced the investment of RMB2.157 billion ($297.85 million) to build a high-density and hybrid IC packaging and testing plant.
Huawei announced a comprehensive collaboration with Meituan to innovate industries, apply technologies, and develop businesses using HarmonyOS
Nikkei Asia reported a teardown on China’s Huawei Technologies’ recently released Mate 60 Pro, which shows an increasingly sourced components for its smartphones in China and the Chinese parts constitute 47% on a value basis
China Telecom, the country’s leading telecom carrier, unveiled its large language model Xingchen
China's leading memory chip producer Yangtze Memory Technologies Co (YMTC) filed a lawsuit against US-based Micron Technology on November 9 for infringement of eight of YMTC's patents.
Chinese tech giant Huawei Technologies and eastern Chinese carmaker Chery Automobile jointly released smart vehicle model Luxeed S7 on November 9.
US major chipmakers actively participate in CIIE despite escalating tech rivalries between the two global powers
Intel recently announced internally that Lee Choon Heung (Li Chunxing) would take over as the general manager of its packaging and testing department.
South Korea's Samsung Electronics and its US subsidiary initiated a patent invalidation declaration against China Datang Mobile Communications Equipment (大唐移动) in the US District Court for the Eastern District of Virginia.
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