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  • German equipment company Manz AG promotes new packaging technology FOPLP to Chinese automotive chips suppliers

    German equipment manufacturer Manz AG showcased its adavanced packaging solution - FOPLP (Fan-Out Panel Level Packaging) - at the SEMICON China 2023 held in Shanghai earlier this month.

    2w ijiwei
    07-13 16:08
  • Chinese packaging suppliers face new opportunities in advanced packaging driven by AI development

    The sweeping wave of AI such as large-language models and emerging 5G industries, is driving fast advanced packaging development for more computing power chips.

    2.5w ijiwei
    05-23 16:04
  • Chinese advanced packaging startup KiwiMoore calls on more chip design houses to adopt Chiplets, creating a more mature ecosystem

    KiwiMoore calls on more chip design houses to adopt Chiplets

    2.9w ijiwei
    01-28 17:37
  • Tech Forum: BT Substrate Enables Progress of Advanced Packaging

    BT Substrate Enables Progress of Advanced Packaging

    3w ijiwei
    01-04 14:26
  • Why Advanced Packaging Materials Matter?(Part B)

    “Why Advanced Packaging Materials Matter?” gives insights in two parts on this new frontier of semiconductor technology developments.

    5w ijiwei
    06-16 12:23
  • Chinese IC packaging companies face month-on-month revenue drop in Q1 and hope advanced packaging to drive their growth

    Major Chinese IC packaging companies have stepped into advanced packaging—FCBGA in particular, but need to survive the current market downturn, said a JW Insights article.

    3.3w ijiwei
    05-30 17:56
  • JW Insights Tech Forum: Why Advanced Packaging Materials Matter? (Part A)

    “Why Advanced Packaging Materials Matter?” gives insights in two parts on this new frontier of semiconductor technology developments.

    2.4w ijiwei
    05-25 20:57
  • Huawei explores IC product breakthroughs through advanced packaging and optimizing system architecture

    Huawei’s rotating chairman Guo Ping explained Huawei’s IC strategy facing the blockade by the U.S. sanctions, saying it expects to make breakthroughs in advanced packaging at Huawei’s 2021 annual performance conference.

    3.3w ijiwei
    04-01 18:21
  • China’s global packaging and testing provider JCET Group strives hard to compete in the Post-Moore era

    The Post-Moore era brings excellent potential to the packaging and testing industry. China’s JCET(长电科技) Group will continue to lead advanced packaging development.

    2.4w ijiwei
    03-22 11:18
  • The conventional IC packaging capacity shortage is being eased, while the demand for advanced packaging is still strong, creating an imbalance between supply and demand

    4w ijiwei
    09-28 10:00

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    • 北京多所高校禁用罗马仕充电宝 公司致歉:若有缺陷将依法担责

      1w ijiwei
      06-15 13:15

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