German equipment company Manz AG promotes new packaging technology FOPLP to Chinese automotive chips suppliers German equipment manufacturer Manz AG showcased its adavanced packaging solution - FOPLP (Fan-Out Panel Level Packaging) - at the SEMICON China 2023 held in Shanghai earlier this month. 1.3w 07-13 16:08 Chinese packaging suppliers face new opportunities in advanced packaging driven by AI development The sweeping wave of AI such as large-language models and emerging 5G industries, is driving fast advanced packaging development for more computing power chips. 1.8w 05-23 16:04 Chinese advanced packaging startup KiwiMoore calls on more chip design houses to adopt Chiplets, creating a more mature ecosystem KiwiMoore calls on more chip design houses to adopt Chiplets 2.2w 01-28 17:37 Tech Forum: BT Substrate Enables Progress of Advanced Packaging BT Substrate Enables Progress of Advanced Packaging 1.7w 01-04 14:26 Why Advanced Packaging Materials Matter?(Part B) “Why Advanced Packaging Materials Matter?” gives insights in two parts on this new frontier of semiconductor technology developments. 3.6w 06-16 12:23 Chinese IC packaging companies face month-on-month revenue drop in Q1 and hope advanced packaging to drive their growth Major Chinese IC packaging companies have stepped into advanced packaging—FCBGA in particular, but need to survive the current market downturn, said a JW Insights article. 2.7w 05-30 17:56 JW Insights Tech Forum: Why Advanced Packaging Materials Matter? (Part A) “Why Advanced Packaging Materials Matter?” gives insights in two parts on this new frontier of semiconductor technology developments. 1.9w 05-25 20:57 Huawei explores IC product breakthroughs through advanced packaging and optimizing system architecture Huawei’s rotating chairman Guo Ping explained Huawei’s IC strategy facing the blockade by the U.S. sanctions, saying it expects to make breakthroughs in advanced packaging at Huawei’s 2021 annual performance conference. 2.8w 04-01 18:21 China’s global packaging and testing provider JCET Group strives hard to compete in the Post-Moore era The Post-Moore era brings excellent potential to the packaging and testing industry. China’s JCET(长电科技) Group will continue to lead advanced packaging development. 2w 03-22 11:18 The conventional IC packaging capacity shortage is being eased, while the demand for advanced packaging is still strong, creating an imbalance between supply and demand 3.3w 09-28 10:00 MORE READ MOST No Data Yet~ POPULAR TAGS No Data Yet~