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Chinese semiconductor equipment and component suppliers will benefit from the trend of domestic substitution, said Chen Yuenan, director of JW Insights Consulting Division.
Delegates attending the Jiwei Semiconductor Manufacturing Forum on June 2 discussed ways to speed up efforts in localizing semiconductor manufacturing equipment.
An award ceremony at the Jiwei Semiconductor Manufacturing Forum was held on June 2 and seven Chinese equipment and materials companies received awards for their progress for their products.
TF Microelectronics (通富微电), China's leading packaging and testing company, said it’s the largest packaging and testing supplier for AMD and completes 80% of AMD’s packaging and testing business.
China's imports of semiconductor electronic devices from Japan surged by 52.3% year-on-year to 2.613 billion units in April, with the import value of approximately JPY157.555 billion ($1.135 billion).
China slams Japan’s chipmaking equipment exports restriction
Chinese chemical mechanical planarization (CMP) equipment giant Hwatsing Technology (华海清科) has shipped its mass-produced 12-inch ultra-precision wafer thinning equipment Versatile-GP300, to leading IC companies.
Shares of Skyverse Technology (中科飞测), a leading Chinese high-end semiconductor quality control equipment provider, surged 192.8% in its debut on Shanghai’s Nasdaq-style Star Market on May 19.
Chinese Vice-President Han Zheng met with the head of Dutch chip equipment giant ASML in The Hague during his three-day visit to the Netherlands from May 10 to 12.
AMEC launches its self-developed 12-inch wafer LPCVD equipment Preforma Uniflex™ CW