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A new analysis shows that China could emerge as a leader in next-generation power semiconductor production in the next five to 10 years
Chinese power chip manufacturer ZGX Semi (中工信半导体) plans to invest RMB3.8 billion ($549.02 million) in building a new fab in Huizhou, southern China’s Guangdong Province.
Boncom Semi (博康半导体), a Chinese chip startup, started construction of its gallium nitride (GaN) RF power chip project in Jiaxing Economic Development Zone.
Chinese auto chip developer Genesys Microelectronics (复睿微电子) signed a strategic cooperation agreement with Xi'an Jiaotong University
China’s motion control products provider Kanisi Electronics (卡尼思电子) said it would invest $141.17 million in its high-end intelligent controller and semiconductor power chip packaging project in Wuxi, Jiangsu Province.
Intelligent driving enters a period of rapid development in the next 3-5 years with large computing power chips in massive production in China. More Chinese intelligent driving car brands will rise on the global market.
Intel Capital has made a strategic investment in a Chinese power semiconductor design company Shenzhen Vergiga Semiconductor (威兆半导体), according to recent information on Chinese corporation registration platforms.
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