There are about 10 related results
There are about 10 related results
ACCESS Semiconductor (越亚半导体), a Chinese IC packaging substrate company, started the construction of its FCBGA packaging substrate production project in Nantong of eastern China's Jiangsu Province.
QUICK Intelligent Equipment plans to invest RMB1 billion in a semiconductor packaging equipment R&D and manufacturing project in Wujin
Zhejiang Saiyang Electronics (浙江赛扬电子), a Chinese chip startup, officially started its automotive-grade IC packaging and testing project in Jiashan County of eastern China's Zhejiang Province on February 5.
Capcon raises nearly $50 million in Series B2 financing
Chuanghao Semiconductor builds a new plant to promote China’s self-sufficiency in advanced packaging
Major Chinese IC packaging companies have stepped into advanced packaging—FCBGA in particular, but need to survive the current market downturn, said a JW Insights article.
YMTC and CXMT expanding capacity brings growth opportunities for Chinese OSAT vendors
