There are about 65 related results
There are about 65 related results
Chinese integrated circuit packaging and testing services provider Forehope Electronic announced the investment of RMB2.157 billion ($297.85 million) to build a high-density and hybrid IC packaging and testing plant.
Intel recently announced internally that Lee Choon Heung (Li Chunxing) would take over as the general manager of its packaging and testing department.
China’s First Applied Material (福斯特) is spending $270 million to build three new plants in China, Thailand and Vietnam
A master’s student of Xiamen University’s School of Electronic Science and Engineering, wins the first prize in the 2023 IEEE ICEPT Best Student Paper Award recently, JW Insights learned.
Jingneng Microelectronics to sign an agreement with Qianjiang Motorcycles to invest $16.9 million in acquiring 100% equity of Zhejiang Yizhong Packaging Technology
Packaging equipment market is a new hot track for the Chinese listed semiconductor suppliers and startups to move in as the domestic substitution trend deepens and packaging technology advances.
Blue Rocket Electronics (蓝箭电子), a Chinese packaging and testing solution provider, has successfully been listed on the Shenzhen Stock Exchange's ChiNext board on August 10, according to the Exchange announcement.
JCET leverages Chiplet technologies to achieve high-volume production of packaging for 4 nm chips
China's packaging and testing industry has not shown signs of bottoming out, although there were improved order volumes in the second quarter of this year.
German equipment manufacturer Manz AG showcased its adavanced packaging solution - FOPLP (Fan-Out Panel Level Packaging) - at the SEMICON China 2023 held in Shanghai earlier this month.
