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KiwiMoore calls on more chip design houses to adopt Chiplets
JCET, a leading Chinese provider of IC back end manufacturing and technology services, announced that it has achieved high-volume integrated packaging for 4-nanometer chips.
Capcon raises nearly $50 million in Series B2 financing
Chinese OSAT giant JCET’s unique XDFOI Chiplet series packaging technology achieves mass production
BT Substrate Enables Progress of Advanced Packaging
Chuanghao Semiconductor builds a new plant to promote China’s self-sufficiency in advanced packaging
China’s motion control products provider Kanisi Electronics (卡尼思电子) said it would invest $141.17 million in its high-end intelligent controller and semiconductor power chip packaging project in Wuxi, Jiangsu Province.
Wingtech to build a new factory to expand its subsidiary Nexperia’s semiconductor packaging and testing capacity
TF Microelectronics (通富微电), China’s leading packaging company, announced on October 24 that it has completed the R&D of 5nm chips packaging for autonomous vehicles
The Chinese semiconductor equipment industry has faced sliding performances, especially in the packaging and testing fields since this year, particularly after the 2nd quarter.