There are about 51 related results
There are about 51 related results
Chinese packaging and testing manufacturers are suffering in meager profits due to sluggish market demand and production overcapacity, said a recent JW Insights report analyzing 16 major manufacturers.
TF Microelectronics (通富微电), China's leading packaging and testing company, said it’s the largest packaging and testing supplier for AMD and completes 80% of AMD’s packaging and testing business.
The sweeping wave of AI such as large-language models and emerging 5G industries, is driving fast advanced packaging development for more computing power chips.
Wuxi Xindong Semiconductor Technology (无锡芯动半导体科技), a subsidiary of Chinese auto giant Great Wall Motor, will start operating third-generation semiconductor module packaging and testing project by the end of the year.
ACCESS Semiconductor (越亚半导体), a Chinese IC packaging substrate company, started the construction of its FCBGA packaging substrate production project in Nantong of eastern China's Jiangsu Province.
QUICK Intelligent Equipment plans to invest RMB1 billion in a semiconductor packaging equipment R&D and manufacturing project in Wujin
FII (Foxconn Industrial Internet工业富联), the Shenzhen-based subsidiary of Hon Hai, bought ASE Group’s four Chinese mainland packaging and testing plants
Chinese packaging supplier China Wafer Level CSP (WLCSP,晶方科技) plans to buy another 6.61% of a Dutch company Anteryon at 2.7 million euros, announced the company on March 27.
World-famous packaging company Boschman will set up a third-generation semiconductor and integrated circuits equipment R&D and manufacturing center in Suzhou, eastern China’s Jiangsu Province.
Great Wall Motor’s subsidiary begins construction on its semiconductor plant in Wuxi
