There are about 29 related results
There are about 29 related results
The research team headed by Wei Xing of the Shanghai Institute of Microsystems (SIM) of the Chinese Academy of Sciences has made a breakthrough in 300mm Silicon-on-insulator (SOI) wafer manufacturing technology.
UNISOC, in collaboration with Rohde & Schwarz, completes the industry’s first IoT NTN RF consistency test case verification
Chipbetter Microelectronics (芯百特), a Chinese RF chip supplier, announced that it has recently completed a new round of financing of nearly RMB100 million($13.90 million), said the company recently.
TSMC held its annual tech forum in Shanghai and launched its latest N3AE and N3A processes for automotive chips
JCET launches new SiP solution for 5G RF power amplifiers
Chinese EDA company NineCube (九同方) is developing three new EDA tools for RF products and is expected to complete full capacity in 2025
Guotai Junan Technology(国泰军安) signed up to settle its production base for microwave module and millimeter-wave microsystem in China-Europe Industrial Innovation Zone in Wuxi.
Boncom Semi (博康半导体), a Chinese chip startup, started construction of its gallium nitride (GaN) RF power chip project in Jiaxing Economic Development Zone.
Honor, the Chinese smartphone brand spun off from Huawei, launched its first self-developed RF enhancement chip Honor C1 at its March 6 new product release event of Honor Magic5 series.
FinDreams Technology (弗迪科技), a subsidiary of Chinese EV giant BYD, rolled out its new generation of RF1 front millimeter-wave radar on March 5.
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