There are about 19 related results
There are about 19 related results
China officially released on August 1 the first CPO (co-packaged optics) technology standards
JCET leverages Chiplet technologies to achieve high-volume production of packaging for 4 nm chips
NSFC has planned to provide up to RMB46 million ($6.4 million) to finance projects focused on “chiplet” technology
Chinese AI chiplet startup Yuanli Semiconductor (原粒半导体) announced recently that it raised tens of millions of RMB in seed funding led by Innoangel Fund.
Top international design companies have commercialized Chiplet technology on a small scale while Chinese players are still working on the sector, said a recent JW Insight report on the Chiplet industry chain.
TF Microelectronics (通富微电), China's leading packaging company, has mass produced Chiplet-based products for the US chip giant AMD.
KiwiMoore calls on more chip design houses to adopt Chiplets
JCET, a leading Chinese provider of IC back end manufacturing and technology services, announced that it has achieved high-volume integrated packaging for 4-nanometer chips.
Chinese OSAT giant JCET’s unique XDFOI Chiplet series packaging technology achieves mass production
The 2022 Beijing International Seminar on Micro-Electronics & IC WORLD Conference was successfully held on December 28 in Beijing to track the IC industry's developments, promote, and coordinate the industry chain.
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