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TF Microelectronics (通富微电), China's leading packaging company, has mass produced Chiplet-based products for the US chip giant AMD.
KiwiMoore calls on more chip design houses to adopt Chiplets
JCET, a leading Chinese provider of IC back end manufacturing and technology services, announced that it has achieved high-volume integrated packaging for 4-nanometer chips.
Chinese OSAT giant JCET’s unique XDFOI Chiplet series packaging technology achieves mass production
The 2022 Beijing International Seminar on Micro-Electronics & IC WORLD Conference was successfully held on December 28 in Beijing to track the IC industry's developments, promote, and coordinate the industry chain.
What specific application fields are currently on the chiplet track that benefit the most from advanced chiplet technology?
New opportunities have emerged for the EDA companies in the Chinese mainland given EDA’s crucial role in the large-scale industrialization of 3D IC
When will the Chiplet ecosystem be built? Which perspectives are the focus of construction? How will countries perform? .
How will the bill affect or reshape the development of chiplet? What opportunities or challenges do core particles present for companies of different sizes and market shares?
The chiplet may serve as an opportunity for China to address its IC self-sufficiency, but can’t solve its advanced chip manufacturing predicament