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  • China releases its first CPO technology standard, a derivative of chiplet standard

    China officially released on August 1 the first CPO (co-packaged optics) technology standards

    1.7w ijiwei
    08-08 11:33
  • China’s leading OSAT company JCET Group achieves high-volume packaging of 4-nanometer chips by leveraging Chiplet technology

    JCET leverages Chiplet technologies to achieve high-volume production of packaging for 4 nm chips

    2.3w ijiwei
    08-04 15:38
  • SCMP: China’s natural science fund supports new ‘chiplet’ tech research to advance semiconductor self-sufficiency amid threat of new US sanctions

    NSFC has planned to provide up to RMB46 million ($6.4 million) to finance projects focused on “chiplet” technology

    2.3w ijiwei
    08-04 14:11
  • Chinese AI chiplet startup Yuanli Semiconductor secures seed funding in tens of millions of RMB only two months after its founding

    Chinese AI chiplet startup Yuanli Semiconductor (原粒半导体) announced recently that it raised tens of millions of RMB in seed funding led by Innoangel Fund.

    1.8w ijiwei
    06-29 16:10
  • JW Insights releases report on Chiplet industry chain

    Top international design companies have commercialized Chiplet technology on a small scale while Chinese players are still working on the sector, said a recent JW Insight report on the Chiplet industry chain.

    8647 ijiwei
    05-17 17:20
  • China's leading packaging company TF Microelectronics mass produces Chiplet-based products for AMD

    TF Microelectronics (通富微电), China's leading packaging company, has mass produced Chiplet-based products for the US chip giant AMD.

    2.5w ijiwei
    02-16 17:02
  • Chinese advanced packaging startup KiwiMoore calls on more chip design houses to adopt Chiplets, creating a more mature ecosystem

    KiwiMoore calls on more chip design houses to adopt Chiplets

    2.9w ijiwei
    01-28 17:37
  • Chinese leading packaging company JCET adopts Chiplet technology to achieve high-volume packaging of 4-nanometer chips

    JCET, a leading Chinese provider of IC back end manufacturing and technology services, announced that it has achieved high-volume integrated packaging for 4-nanometer chips.

    3.7w ijiwei
    01-13 15:03
  • Chinese leading packaging company JCET starts mass production of its unique XDFOI Chiplet series

    Chinese OSAT giant JCET’s unique XDFOI Chiplet series packaging technology achieves mass production

    1.6w ijiwei
    01-09 17:57
  • The 2022 Beijing International Seminar on Micro-Electronics & IC WORLD Conference successfully held

    The 2022 Beijing International Seminar on Micro-Electronics & IC WORLD Conference was successfully held on December 28 in Beijing to track the IC industry's developments, promote, and coordinate the industry chain.

    2.3w ijiwei
    12-30 16:30

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    • 北京多所高校禁用罗马仕充电宝 公司致歉:若有缺陷将依法担责

      1w ijiwei
      06-15 13:15

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