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US-led export control measures could push China to successfully develop its own technology in advanced chipmaking machines.
TCL Zhonghuan, a leading Chinese photovoltaic silicon wafer maker, plans to acquire through its subsidiary the equity of Xinxin Semiconductor to expand its silicon wafer production capacity.
Chinese display driver IC supplier Aplus Semiconductor invested RMB10.05 billion ($1.48 billion) in a COF-IC project in Mianyang, western China’s Sichuan Province.
The Shanghai-based leading foundry Hua Hong Semiconductor announced on January 18 that it would establish a 12-inch wafer foundry with HHGrace, National IC Industry Fund II (Big Funds) and an investment company in Wuxi.
JCET, a leading Chinese provider of IC back end manufacturing and technology services, announced that it has achieved high-volume integrated packaging for 4-nanometer chips.
Capcon raises nearly $50 million in Series B2 financing
More Chinese EDA companies are becoming suppliers in Samsung’s foundry service as a result of geopolitical changes
Chinese OSAT giant JCET’s unique XDFOI Chiplet series packaging technology achieves mass production
US sanctions are minimally working but only serve as a catalyst for China to promote its drive for self-sufficiency in chip making, said Robert Castellano, president of The Information Network.
BT Substrate Enables Progress of Advanced Packaging